Nvidia has been working on a prototype multi-die AI accelerator chip called RC 18. The 36-module strong chip, developed by Nvidia Research, is currently being evaluated in the labs, and its highly ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
SANTA CLARA, Calif., May 31, 2023 -- Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced silicon ...
WeiHsun is a guest author and Deputy Manager, Core Methodology Department, at Global Unichip Corp. In the rapidly evolving world of ASIC design, the shift from monolithic to 2.5D and 3D multi-die ...
The slow-down of lithographic scaling in semiconductor devices has had a major impact on the design of computer enabled products. Semiconductor designers are looking for new ways to provide the ...
Back in November 2008, with the introduction of its significantly redesigned 45nm Nehalem architecture (see: first-gen Core i7 Series), Intel took its traditional three-part northbridge / CPU / ...
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